[EB-IMX8MM] 1. Unboxing EBOX-IMX8MM

November 30, 2020


The NXP i.MX8M Mini ARM Cortex-A53 processor has been widely incorporated into IPC development projects. However, ICOP has built an entire system around the i.MX8M Mini that encompasses a great build and quality product like the Panel PC and Box PC.

The EBOX-IMX8MM is an ARM-based EBOX offered by ICOP. that is ready to be implemented into a wide range of products. The EBOX has a line of features including being fanless, having a small footprint, and a premium aluminum cover. The EBOX also has standard VESA and DIN Rail mounting options and supports a wide temperature range from -40 to 80 °C bolstering its industrial usage options. This ARM Cortex A-53 processor features rich I/O and equipped with GPU and VPU, capable of Audio and HDMI with high-performance processing while being optimized for low-power consumption. Buyers can also select the pre-installed OS of Android 9 &Yocto Linux when placing the order.





System Specifications
Processor NXP i.MX8M Mini Quad-core 1.6 GHz ARM Cortex-A53 processor
Memory 1GB to 4GB LPDDR4 onboard
HDMI HDMI 1.3 (MAX.1920 x 1080 pixels)
Ethernet RJ45 x2 (Intel I1210 GbE x1/CPU GbE x1)
USB USB 2.0 x3 (Front x2 + Rear x1)
HD Audio Mic-in & Line-out (WM8960)
SD card slot SD Slot x1 (Internal slot Optional)
Extension I/F 8GB to 64GB eMMC MLC/SLC onboard
Extension I/F WiFi 802.11b/g/n & BT4.1 Combo 2.4G (Broadcom 43438)
RS-232 D-Sub 9-pin connector x2 or x4 ports
RS-485 D-Sub 9-pin connector x2 ports
Power requirement DC +12V~+36V
Dimensions 115 x 115 x 35mm/DIN Rail Support (Optional)
Net Weight 700g
Operation Temperature 0 ~ +60℃/-40 ~ +80℃
Certifications CE, FCC, VCCI
OS Support Android 9, Yocto, Mainline Linux Kernel Support



Package box dimension 240 x 220 x 170mm, includes:

  • EBOX-IMX8MM x 1pcs
  • 22.5W Power supply x 1pcs
  • Rubber pads sticker x 1pcs
  • VESA screw x 4pcs
  • Protection Paperboard box




EBOX-IMX8MM Diagram:

EB-IMX8MM-FrontView EB-IMX8MM-RearView.png EB-IMX8MM-SideView

*Black aluminum cover is attached to the processor as a heatsink with the fins providing greater heat transfer.



It’s been through plenty of verifications and tests to meet the highest satisfaction.




Tiny Devices, BIG Applications.

EB-IMX8MM-Industrial EB-IMX8MM-Automotive EB-IMX8MM-Technologies EB-IMX8MM-SmartHome EB-IMX8MM-SmartCity

(For the detailed application info, please click the NXP applications reference link.)