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In the wave of AI-driven technological transformation, the integration of AI with 5G, IoT, and Machine Learning (ML) is widely applied to edge devices such as smartphones, AI PCs, drones, smart homes, and industrial equipment, driving comprehensive advances in automation, connectivity, and intelligence. At the same time, the development of distributed computing enhances the responsiveness and efficiency of edge devices, overcoming the latency and resource bottlenecks of cloud computing, and accelerating the adoption of applications such as smart homes and smart cities to create a safer and more convenient lifestyle.
The “2025 EE Intelligent TechCon” will focus on themes including AI Edge Intelligence, Smart Living, Robotics/Drones, Satellite and Next-Generation Communication, and Chiplet/Advanced Packaging. The event will explore how AI technology is applied in smart computing, connectivity, transportation, and security systems, offering participants a comprehensive platform to discover new opportunities in future technologies and intelligent living.
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Location of the event |
Taipei New Horizon 6F |
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Booth number |
J08 |
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Opening Hours |
October 01-02 ,2025 |
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Website |
For more info and sample request, please write to info@icop.com.tw, call your nearest ICOP Branch, or contact our Worldwide Official Distributor.